Photolithography - SMTS, PD, Advance NAND

This role is part of Micron’s Technical Leadership Program (TLP)—a career path for individuals who advance Micron and the industry through technical excellence, innovation, influence, and mentorship. TLP members are expected to set technical direction, lead through influence, and develop the next generation of technical leaders.

Key Responsibilities:

• Define and lead pathfinding photolithography projects for future technology nodes and novel memory architectures.

• Establish long‑term photolithography technology vision and roadmaps, aligned with device scaling, yield, cost, and manufacturability goals.

• Drive early development and de‑risking of disruptive lithography solutions, including materials, processes, equipment, and patterning schemes.

• Serve as a recognized technical authority, influencing technology decisions across R&D, integration, and manufacturing organizations.

• Lead cross‑functional and cross‑site initiatives, ensuring alignment and execution of high‑impact technology programs.

• Partner with suppliers to co‑innovate next‑generation tools, materials, and metrology capabilities.

• Oversee advanced process development including imaging, overlay, OPC, process window optimization, and advanced process control.

• Generate and steward intellectual property, including patents, publications, and internal technical standards.

• Mentor and develop engineers as part of Micron’s Technical Leadership Program (TLP), shaping the next generation of technical leaders.

Required Qualifications:

• Ph.D. (preferred) or M.S. in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or related field with at least 15 years of experience in semiconductor photolithography advanced process development

• Recognized expertise in advanced imaging physics, including immersion lithography, polarized illumination, low‑k1 imaging, and pattern fidelity challenges.

• Proven record of defining and leading high‑impact technology programs from concept through development and transfer.

• Strong command of lithography simulation, materials characterization, and statistical analysis.

• Demonstrated ability to influence technical direction at the organizational or enterprise level.

• Exceptional problem‑solving, communication, and technical leadership skills.

Preferred Qualifications:

• Extensive hands‑on and strategic experience with EUV and advanced DUV lithography (365nm, 248nm, 193nm).

• History of pathfinding or pre‑development leadership for new technology nodes or novel device architectures.

• Strong external engagement with equipment and materials suppliers at a technology‑shaping level.

• Established track record of patents, publications, and industry recognition.