Package Health - Principal/Staff/Senior Engineer, Advanced Packaging Technology Development

Micron’s vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.  

We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.  

Job Summary 

The Package Health Engineer will contribute to the development and execution of package health monitoring, simulation, and characterization activities. This role involves hands-on engineering work in DFT, data analysis, and reliability testing to ensure robust packaging solutions. 

Key Responsibilities 

• Develop and implement DFT strategies for advanced packaging. 

• Conduct simulations for mechanical, thermal, and electrical performance. 

• Perform electrical and mechanical characterization of packages. 

• Analyze test and field data to identify early indicators of package degradation. 

• Collaborate with data scientists to build predictive models for package health. 

• Support root cause analysis and corrective actions for reliability issues. 

Qualifications 

• Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, or related field. 

• 2+ years of experience in semiconductor industry (complex products preferred), preferably in packaging, test, or reliability engineering. 

• Hands-on experience with simulation tools and test equipment, working on package characterization, reliability testing or electrical failure analysis. 

• Proficiency in statistics, data analysis and scripting (e.g., Python, MATLAB, JMP). 

• Strong understanding of semiconductor packaging process, material interaction and properties. 

• Good knowledge of DRAM or ASIC product testing, test architecture, and packaging fail modes. 

Additional/Preferred Qualifications 

• Experience with AI/ML tools or statistical modeling. 

• Familiarity with JEDEC or other reliability standards. 

• Strong problem-solving and documentation skills