NAND STG MDE (Manufacturing Development Engineering) Director

Key Roles and Responsibilities are as so: 

1. Process Development & Execution Ownership: Lead a 24/7 MDE organization responsible for PD task execution, wafer runs, data quality, throughput management, and predictable delivery of development priorities. 

2. Technical & Process Ownership: Own endtoend process maturity across assigned modules, including development, qualification, release, and sustaining readiness; identify and resolve complex technical challenges inherent to TD–HVM colocation using robust metrics and learning closure. 

3. Operations Interface & Risk Management: Serve as the primary interface and escalation point between Technology Development and Fab Operations; drive HVET, singlestrand mitigation, redundancy readiness, and tool derisking strategies to ensure operational robustness. 

4. Business Process & Manufacturing Readiness: Develop and lead business processes that enable colocation benefits, including cost and move reduction, variability reduction, resource optimization, HVM BKM adoption, and New Material Introduction (NMI) readiness. 

5. Automation & Productivity Enablement: Drive automation initiatives to improve scalability, consistency, and productivity, reinvesting gains into faster learning cycles and deeper engineering capability. 

6.  Matrix Leadership & Strategic Alignment: Influence and align large, crossfunctional organizations across TD, STPG, Equipment Engineering, and Fab10 HVM; lead teams with up to 100 active participants and indirect impact across thousands of stakeholders. 

7.Quality, Safety & Talent Leadership: Champion a strong culture of safety, quality, accountability, and continuous improvement; build and develop a highperforming, multishift organization through effective talent, performance, and succession management. 

Requirements :

• Bachelor's degree or equivalent or higher in engineering or equivalent technical field 

• Minimum 10 years of semiconductor industry experience, with substantial management/leadership exposure. 

• Demonstrated track record of delivering technology and business results 

• Exceptional technical and people leadership, with a proven ability to lead large, multidisciplinary, matrixed organizations and influence outcomes across global teams.  

• Strong technical foundation in semiconductor manufacturing, including working knowledge of NAND process integration, unit processes, equipment technology, and frontend manufacturing suppliers.  

• Deep understanding of fab business processes and systems, with practical insight into the needs and operating models of both Storage Technology Group (STG) and HighVolume Manufacturing (HVM) organizations.  

• Proven ability to manage complexity and ambiguity, leveraging data, metrics, and structured problemsolving to drive clarity, alignment, and execution.

• Demonstrated success influencing and building consensus with senior technical leaders, peers, and crossfunctional partners across STG, STPG, and Fab Operations.  

• Excellent listening, communication, and presentation skills, with the ability to translate complex technical topics to all organizational levels.  

• Strong organizational and decisionmaking capability, including the ability to marshal resources (people, capital, tools, and time) to meet nearterm commitments while advancing longerterm strategic objectives.  

• Commitment to quality, safety, and operational excellence, including knowledge of quality management systems, human factors, and risk mitigation. 

• Collaborative leadership style, with a demonstrated ability to build strong partnerships, mentor teams, and promote technical capability and talent development.  

• Demonstrated alignment with Micron Values, including accountability, integrity, and continuous improvement.